Application: 

The bottom filling, FPC package, SMT point red glue, LED packaging, component packaging, point tin paste, dot red glue, dot black glue, semiconductor packaging, wafer fixation, etc. 

Independent research and development of precision dispensing with the surface coating system, widely used in SMT and PCB assembly, semiconductor packaging, LED packaging mechanical and electrical assembly, flat panel display assembly, etc., can also replace new energy application and life science, military products of dispensing with coating, precision dispensing, filling and coating is the preferred partner.

Product introduction:

On-line automatic assembly line operation, reduce the workers to remove the material process；

SEMEMA communication function can be connected to the front and rear equipment；

WIN7/XP Chinese operation interface, easy to understand；

Having points, lines, faces, arcs, circles, irregular curves continuous filling and three-axis linkage；

The large storage memory capacity of the hard disk, and the software has the regional array, translational rotational operation and other functions；

The size of glue, the glue speed, the glue time, the time of stop glue can be set, the amount of glue is stable, the glue is not leaking；

Can import AUTO CAD file function, precise and simplified operation；

Mark point automatic positioning function, make sure point glue location is accurate；

Optional pressure bucket storage operation, saving time for glue；

Release time to control the resolution1ms；

Apply fluid point glue/spraying, such as: red adhesive, UV glue, AB glue, epoxy resin, instant glue, transparent paint, water proofing agent, etc.

Specifications: